Roadmap & Planning (V4+)

Architecture documents in this area. Select a page from the navigation.

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Table of contents

• Cognifold Signed Coupling (ARC-084 / MECH-363 / Q-058)
• MECH-423 Super-Additivity Readiness Substrate (R1 / R2 / R3)
• REE Architecture Scaling Needs
• Spintronic-memristive substrates as future physical cognifold candidates
• Substrate Roadmap (V3 enrichment planning)
• V4 Developmental Testing Harness — Spec Sketch
• V4 Planning Index
• V4 Spec (initial deliberate spec, 2026-05-02)